Full Height I/O Bracket for Low Profile Expansion Card

ABSTRACT

An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.

BACKGROUND

1. Technical Field

The present disclosure generally relates to information handling systemsand in particular to expansion cards for insertion into informationhandling systems. Still more particularly, the disclosure relates todesign and configuration of expansion cards for use as high profileexpansion cards.

2. Description of the Related Art

As the value and use of information continue to increase, individualsand businesses seek additional ways to process and store information.One option available to users is information handling systems. Aninformation handling system (IHS) generally processes, compiles, stores,and/or communicates information or data for business, personal, or otherpurposes, thereby allowing users to take advantage of the value of theinformation. Because technology and information handling needs andrequirements vary between different users or applications, informationhandling systems may also vary regarding what information is handled,how the information is handled, how much information is processed,stored, or communicated, and how quickly and efficiently the informationmay be processed, stored, or communicated. The variations in informationhandling systems allow for information handling systems to be general orconfigured for a specific user or specific use such as financialtransaction processing, airline reservations, enterprise data storage,or global communications. In addition, information handling systems mayinclude a variety of hardware and software components that may beconfigured to process, store, and communicate information and mayinclude one or more computer systems, data storage systems, andnetworking systems.

Some information handling systems include add-in or expansion cards. Inconventional implementations, an add-in card has a low profile heat sinkand battery compartment that is supported by a low profile printedcircuit board assembly (PCBA). Increasingly, consideration is beinggiven to mount higher capacity electronic components on a low profilePCBA; however, such components would generate an increased amount ofthermal energy that would exceed the capacity of the current low profileheat sink. The size of the low profile PCBA is not conducive to a largerheat sink, and increasing the size of the heat sink to cover more of thelow profile PCBA undesirably results in having to remotely install thebattery component. However, based on operating metrics of the PCBA andconvenience of implementation, it is desirable for the battery to belocally provided.

BRIEF SUMMARY

Disclosed are an expansion card, an information handling system, and amethod for producing a full height expansion card that enables greaterheat dissipation and localized power availability for low profileprinted circuit board assembly (PCBA). The expansion card includes amounting bracket with a full height I/O panel with a top mounting panelattached thereto extending orthogonally away. A low profile printedcircuit board assembly (PCBA) is physically attached to at least one ofthe top mounting panel and the full height I/O panel, and the mountingbracket and low profile PCBA define a full height expansion card thatcan accommodate a full height heat sink. The low profile PCBA has a cardedge that is insertably connectable to an I/O connector of aninformation handling system (IHS) to communicate with other componentsof the IHS. A full height heat sink is attached to the low profile PCBAand extends across a portion of the top mounting panel, providingincreased heat dissipation for functional components of the low profilePCBA during operation of the low profile PCBA. A battery compartment ismounted on the mounting panel and supplies power to the functionalcomponents.

According to at least another aspect of the present disclosure, aninformation handling system has an enclosure having at least one I/Oconnector in communication with enclosed components of the informationhandling system. An I/O panel frame is attached across an opening in theenclosure. The I/O panel of the expansion card is insertably connectedto the I/O connector and physically connected to the I/O panel frame.According to at least one aspect of the present disclosure, the fullheight I/O panel is sized for insertion in the I/O panel frame of theenclosure of the information handling system.

According to at least an additional aspect of the present disclosure, amethod provides a full height expansion card. A mounting bracket ismanufactured having (i) a full height input/output (I/O) panel sized forinsertion in an I/O panel frame extended across an opening of anenclosure of an information handling system and (ii) a top mountingpanel attached to the full height I/O panel and extending orthogonallyaway from the full height I/O panel. A low profile PCBA is physicallyattached to at least one of the top mounting panel and the full heightI/O panel, and the mounting bracket and low profile PCBA define a fullheight expansion card. A full height heat sink is attached to the lowprofile PCBA and the full height heat sink extends across the topmounting panel. The full height heat sink enables efficient dissipationof heat generated by the low profile PCBA away from one or morefunctional components of the low profile PCBA.

The above presents a general summary of several aspects of thedisclosure in order to provide a basic understanding of at least someaspects of the disclosure. The above summary contains simplifications,generalizations and omissions of detail and is not intended as acomprehensive description of the claimed subject matter but, rather, isintended to provide a brief overview of some of the functionalityassociated therewith. The summary is not intended to delineate the scopeof the claims, and the summary merely presents some concepts of thedisclosure in a general form as a prelude to the more detaileddescription that follows. Other systems, methods, functionality,features and advantages of the claimed subject matter will be or willbecome apparent to one with skill in the art upon examination of thefollowing figures and detailed written description.

BRIEF DESCRIPTION OF THE DRAWINGS

The description of the illustrative embodiments can be read inconjunction with the accompanying figures. It will be appreciated thatfor simplicity and clarity of illustration, elements illustrated in thefigures have not necessarily been drawn to scale. For example, thedimensions of some of the elements are exaggerated relative to otherelements. Embodiments incorporating teachings of the present disclosureare shown and described with respect to the figures presented herein, inwhich:

FIG. 1 illustrates a block diagram of an example information handlingsystem within which various aspects of the disclosure can beimplemented, according to one or more embodiments;

FIG. 2 illustrates a block diagram of an example expansion card withconnection to/within an information handling system, according to one ormore embodiments,;

FIG. 3 illustrates an isometric front side view of an expansion card,according to one embodiment;

FIG. 4 illustrates an isometric exploded front view of the expansioncard of FIG. 2 m according to one embodiment;

FIG. 5 illustrates an isometric view of a portion of an enclosure of theexample information handling system of FIG. 1 and a back side view ofthe expansion card of FIG. 2;

FIG. 6 illustrates a top isometric view of an assembled expansion cardin the enclosure of FIG. 5; and

FIG. 7 illustrates a flow diagram of a method for generating a fullheight expansion card with a full height heat sink using a low profilePrinted Circuit Board Assembly (PCBA), according to one embodiment.

DETAILED DESCRIPTION

The described embodiments of the disclosure provide an expansion card,an information handling system, and a method for producing a full heightexpansion card that enables greater heat dissipation and localized poweravailability for low profile printed circuit board assembly (PCBA). Theexpansion card includes a mounting bracket with a full height I/O panelwith a top mounting panel attached thereto extending orthogonally away.A low profile printed circuit board assembly (PCBA) is physicallyattached to at least one of the top mounting panel and the full heightI/O panel, and the mounting bracket and low profile PCBA define a fullheight expansion card that can accommodate a full height heat sink. Thelow profile PCBA has a card edge that is insertably connectable to anI/O connector of an information handling system (IHS) to communicatewith other components of the IHS. A full height heat sink is attached tothe low profile PCBA and extends across a portion of the top mountingpanel, providing increased heat dissipation for functional components ofthe low profile PCBA during operation of the low profile PCBA. A batterycompartment is mounted on the mounting panel and supplies power to thefunctional components.

According to one aspect, the present disclosure provides a solution forconverting a low profile printed circuit board assembly (PCBA) into afull height expansion card, with corresponding heat dissipatingcapabilities as a high profile PCBA. A mounting bracket attached to aninput/output (I/O) panel of the full height expansion card can provideadditional retention for a battery module and for a heat sink. In anexemplary implementation for PowerEdge Raid Controller (PERC) cards, aPERC 9 heat sink is larger than a PERC 8 heat sink. For backwardcompatibility, the PERC 9 heat sink is attachable to a low profileprinted circuit board assembly (PCBA) that may have the same form, fitand function. To avoid having to relocate a battery compartment that wasused on the PERC 8, the full height I/O bracket provides a battery spacefor the battery compartment and provides additional area for underlyingand supporting a portion of the PERC 9 heat sink. By retaining thebattery within close proximity to a printed wiring assembly (PWA) of thelow profile PCBA, installation of a short electrical wiring connectorprovides installation simplicity and higher electrical efficiency than along electrical wiring connector that would otherwise be required.

In the following detailed description of exemplary embodiments of thedisclosure, specific exemplary embodiments in which the disclosure maybe practiced are described in sufficient detail to enable those skilledin the art to practice the disclosed embodiments. For example, specificdetails such as specific method orders, structures, elements, andconnections have been presented herein. However, it is to be understoodthat the specific details presented need not be utilized to practiceembodiments of the present disclosure. It is also to be understood thatother embodiments may be utilized and that logical, architectural,programmatic, mechanical, electrical and other changes may be madewithout departing from general scope of the disclosure. The followingdetailed description is, therefore, not to be taken in a limiting sense,and the scope of the present disclosure is defined by the appendedclaims and equivalents thereof

References within the specification to “one embodiment,” “anembodiment,” “embodiments”, or “one or more embodiments” are intended toindicate that a particular feature, structure, or characteristicdescribed in connection with the embodiment is included in at least oneembodiment of the present disclosure. The appearance of such phrases invarious places within the specification are not necessarily allreferring to the same embodiment, nor are separate or alternativeembodiments mutually exclusive of other embodiments. Further, variousfeatures are described which may be exhibited by some embodiments andnot by others. Similarly, various requirements are described which maybe requirements for some embodiments but not other embodiments.

It is understood that the use of specific component, device and/orparameter names and/or corresponding acronyms thereof, such as those ofthe executing utility, logic, and/or firmware described herein, are forexample only and not meant to imply any limitations on the describedembodiments. The embodiments may thus be described with differentnomenclature and/or terminology utilized to describe the components,devices, parameters, methods and/or functions herein, withoutlimitation. References to any specific protocol or proprietary name indescribing one or more elements, features or concepts of the embodimentsare provided solely as examples of one implementation, and suchreferences do not limit the extension of the claimed embodiments toembodiments in which different element, feature, protocol, or conceptnames are utilized. Thus, each term utilized herein is to be given itsbroadest interpretation given the context in which that terms isutilized.

FIG. 1 illustrates a block diagram representation of an exampleinformation handling system (IHS) 100, within which one or more of thedescribed features of the various embodiments of the disclosure can beimplemented. For purposes of this disclosure, an information handlingsystem, such as IHS 100, may include any instrumentality or aggregate ofinstrumentalities operable to compute, classify, process, transmit,receive, retrieve, originate, switch, store, display, manifest, detect,record, reproduce, handle, or utilize any form of information,intelligence, or data for business, scientific, control, or otherpurposes. For example, an information handling system may be a handhelddevice, personal computer, a server, a network storage device, or anyother suitable device and may vary in size, shape, performance,functionality, and price. The information handling system may includerandom access memory (RAM), one or more processing resources such as acentral processing unit (CPU) or hardware or software control logic,ROM, and/or other types of nonvolatile memory. Additional components ofthe information handling system may include one or more disk drives, oneor more network ports for communicating with external devices as well asvarious input and output (I/O) devices, such as a keyboard, a mouse, anda video display. The information handling system may also include one ormore buses operable to transmit communications between the varioushardware components.

Referring specifically to FIG. 1, example IHS 100 includes one or moreprocessor(s) 105 coupled to system memory 110 via system interconnect115. System interconnect 115 can be interchangeably referred to as asystem bus, in one or more embodiments. Also coupled to systeminterconnect 115 is a local storage controller 122 coupled to localstorage 120 within which can be stored software and one or more sets ofdata (not specifically shown). As shown, system memory 110 can includetherein a plurality of modules, including firmware (F/W) 112, basicinput/output system (BIOS) 114, operating system (O/S) 116 andapplication(s) 118. The various software and/or firmware modules havevarying functionality when their corresponding program code is executedby processor(s) 105 or other processing devices within IHS 100.

IHS 100 further includes one or more input/output (I/O) controllers 130which support connection to and processing of signals from one or moreconnected input device(s) 132, such as a keyboard, mouse, touch screen,or microphone. I/O controllers 130 also support connection to andforwarding of output signals to one or more connected output devices134, such as a monitor or display device or audio speaker(s).Additionally, in one or more embodiments, one or more deviceinterface(s) 136, such as an optical reader, a universal serial bus(USB), a card reader, Personal Computer Memory Card InternationalAssociation (PCMCIA) port, and/or a high-definition multimedia interface(HDMI), can be associated with IHS 100. Device interface(s) 136 can beutilized to enable data to be read from or stored to correspondingremoval storage device(s) 138, such as a compact disk (CD), digitalvideo disk (DVD), flash drive, or flash memory card. In one or moreembodiments, device interface(s) 136 can also provide an integrationpoint for connecting other device(s) to IHS 100. In such implementation,device interface(s) 136 can further include General Purpose I/Ointerfaces such as I²C, SMBus, and peripheral component interconnect(PCI) buses.

IHS 100 comprises a network interface device (NID) 140. NID 140 enablesIHS 100 to communicate and/or interface with other devices, services,and components that are located external to IHS 100. These devices,services, and components can interface with IHS 100 via an externalnetwork, such as example network 150, using one or more communicationprotocols. Network 150 can be a local area network, wide area network,personal area network, and the like, and the connection to and/orbetween network 150 and IHS 100 can be wired or wireless or acombination thereof. For purposes of discussion, network 150 isindicated as a single collective component for simplicity. However, itis appreciated that network 150 can comprise one or more directconnections to other devices as well as a more complex set ofinterconnections as can exist within a wide area network, such as theInternet.

Processing capabilities of the example IHS 100 can be readilyconfigurable by providing one or more I/O connectors 160. For clarity,three I/O connectors 160 are depicted that are internal to an enclosure162 that houses at least a portion of the example IHS 100. One of theI/O connectors 160 is in communication with an expansion card 165, andthe I/O connector serves as an interface between the expansion card 165and other components of the information handling system 100. I/Oconnectors can be coupled to and/or controlled by a separate controllermodule 155, which is illustrated using dashed lines to indicate that themodule is optional and not necessarily a part of or provided within IHS100. It should be appreciated that the example IHS 100 may have adistributed architecture with certain components remotely accessed.Alternatively, or in addition, the expansion card 165 may communicatewith components that are accessible via the network 150.

The example expansion card 165 can provide additional processingcapabilities and backward compatibility for an information handlingsystem 100. Some information handling systems include add-in orexpansion cards 165 such as, for example, PowerEdge Raid Controller(PERC) cards wherein “RAID” refers to redundant array of independentdisks. A RAID system is a data storage system wherein data isdistributed across a group of storage hard disk drives functioning as asmall storage unit. Often, information stored on each disk is duplicatedon other disks in the array, creating redundancy to ensure noinformation is lost if disk failure occurs.

FIG. 2 provides a more detailed view of the expansion card 165 insertedinto an I/O connector 160 of IHS 100. Expansion card 165 generallyincludes a full height mounting bracket 204, which allows the expansioncard 165 to be interchangeably referred to as a full height expansioncard 165. This configuration of a full height expansion card 165 isprovided, even though the processing capabilities can be based upon alow profile printed circuit board assembly (PCBA) 206. Thereby, supportfor additional processing capability is provided by giving additionalreal estate (space) for mounting of components as well as providingother structural features, such as a larger heat sink.

The full height I/O panel 218 is attached to a top mounting panel 220 toform the full height mounting bracket 204. For example, the attachmentof full height I/O panel 218 to top mounting panel 220 can be achievedby stamp forming of sheet metal into a single formed part. As anotherexample, the attachment can be achieved by fastening, affixing orassembling separate components to form the full height mounting bracket204. As an additional example, the attachment can be achieved by moldingthe full height mounting bracket 204 having the top mounting panel 220and full height I/O panel 218. As a further example, the attachment canbe achieved by a combination of some or all of the aforementionedprocesses.

In some implementations, one or more processing components 224incorporated into the low profile PCBA 206 have additionalinterconnectivity and support requirements that are provided by theexpansion card 165. For example, low profile PCBA 206 can include anexternal I/O connector 226 that can be in electronic communication withthe one or more processing components 224. Alternatively or in addition,the external I/O connector 226 can be connected through the low profilePCBA 206 and internal I/O connector 210 to enclosed component 212 of theIHS 100. The external I/O connector 226 can be attached through the fullheight I/O panel 218 to be externally exposed at the I/O panel frame 214for wired or wireless connection.

As shown, structural support for the larger heat sink and batterycompartment is provided by adding a top mounting panel to form a fullheight expansion card on which is provided a full height heat sink.Thus, the mounting bracket 204 can support the performance requirementsof one or more processing components 224 by structurally supporting thelarger heat sink, which in turn enables use of more advanced processingcomponents which provide increased heat dissipation. A full height heatsink 228 that is in contact with the one or more processing components224 can extend over portions of both the low profile PCBA 206 and thetop mounting panel 220. Moreover, in one embodiment, in addition tostructurally supporting the full height heat sink 228, the material ofthe top mounting panel 220 may assist by dissipating heat of functionalcomponents, such as the one or more processing components 224.Alternatively, or in addition, the top mounting panel 220 of the fullheight mounting bracket 204 of the expansion card 165 can provide abattery space 230 for mounting of a battery compartment/holder forhousing a battery 232 to supply backup power to the one or moreprocessing components 224.

In an exemplary aspect, consistent with one or more embodiments, the IHS100 has an enclosure 208 having at least one internal I/O connector 210in communication with enclosed component 212 of the IHS 100. Engagementbetween the internal I/O connector 210 and the card I/O connector 222 ofthe low profile PCBA 206 provides a measure of structural support inaddition to electronic interconnectivity. Additional structural supportto the expansion card 165 is provided by engagement between an I/O panelframe 214 that is attached across an opening 216 in the enclosure 208and a full height I/O panel 218 of the expansion card 165. The fullheight mounting bracket 204 can be sized for insertion in the fullheight I/O panel frame 214 by having a top mounting panel 220 attachedto the full height I/O panel 218 and extending orthogonally away fromthe full height I/O panel. For instance, the full height I/O panel 218may be inserted into the I/O panel frame 214 simultaneously with or atleast along a common plane of movement with insertion of a portion ofthe low profile PCBA 206, such as a card edge 222, into the internal I/Oconnector 210.

With reference to FIGS. 3-4, an exploded view of exemplary expansioncard 165 is depicted. Expansion card 165 has a mounting bracket 304 thatsupports a full height heat sink 306 and allows for mounting of abattery compartment 308. The full height heat sink 306 is configuredsuch that the heat sink does not cover a distal portion of the mountingbracket 304 to present a battery space 309 for placement of the batterycompartment 308.

As one example, the expansion card 165 can be PERC 9 card for performingRAID operations. During normal operations, the full height heat sink 306dissipates an increased amount of heat generated by functional orprocessing components 312 (FIG. 4). During operation of the functionalor processing components 312, user data may be transferred to/from theone or more functional or processing components 312 from/to the RAIDhard disk drives (not shown in FIGS. 3-4). As part of the transfer, datacan be stored in volatile memory such as memory cache as part of thetransfer of the data to/from the RAID disk drives. If a system powerloss occurs it is advantageous to be able to maintain the data transferof the data that has already been staged in the memory cache. Thus, abattery module 314 inserted into the battery compartment 308 can be usedas a backup battery system to provide power to the cache memory so thatthe cache memory does not lose the data that has not yet beentransferred. The battery power may thus power the cache memory until thesystem power becomes stable again so that data in the cache may then bereliably transferred to the RAID hard disk drives.

The expansion card 165 is configured for insertion into an informationhandling system as a full height expansion card by virtue of themounting bracket 304. In particular, the mounting bracket 304 includes afull height input/output I/O panel 316 and a top mounting panel 318attached to the full height I/O panel 316 and extending orthogonallyaway from the full height I/O panel 316. The low profile PCBA 310 isphysically attached to one or both of the top mounting panel 318 and thefull height I/O panel 316. For example, the low profile PCBA 310 canhave a pair of mounting holes 321, 323 spaced for attachment to upperand lower tabs 322, 324 of a low profile I/O panel 316. A tab 322 on thetop mounting panel 318 is attached to a hole 334 through a top inwardcorner of the low profile PCBA 310. As shown in FIG. 4, bolts 336 fastenthe tabs 328, 330, 332 to holes 321, 323, 334.

The full height I/O panel 316 of the mounting bracket 304 can also havea pair of upper and lower tabs 328, 330 presenting respective mountingholes identically positioned to the low profile I/O panel 326. Therebyinterchangeability is achieved for the low profile PCBA 310 between fullheight and low profile installations. The mechanical connection of thevarious individual components allows for backward compatibility to a lowprofile PCBA 310, by attaching a low profile heat sink and a low profileI/O panel 316 in place of the high profile heat sink and full height I/Opanel.

Interchangeability is also facilitated by the mounting of the fullheight heat sink 306. In the illustrated embodiment, the low profile InFIG. 4, PCBA 310 has four holes 338 rectilinearly spaced about thesquare presented by the functional or processing component 312. The fullheight heat sink 306 has the same pattern of holes 340, which is alsoidentical to a low profile heat sink (not shown). The full height heatsink 306 is held into close thermal contact with the functional orprocessing component 312 by attachment of a mounting plate 342. Fourposts 344 are affixed to corner holes 346 in the mounting plate 342 topass through holes 338 in the low profile PCBA 310 and holes 340 in thefull height heat sink 306. Distal ends of the posts 344 receive screws348 that spread posts 344 presenting a locking, ratcheted surface to thefull height heat sink 306.

Other features depicted in FIGS. 3-4 include a full height flange 350 onthe full height I/O panel 316 for fastening in the expansion card 165.In addition, an unattached lengthwise edge of the top mounting panel 318has an embossed surface 352 to frictionally engage a card holder 354(see FIG. 6). Interconnectivity is provided by a circuit edge 356 of thelow profile PCBA 310 and an external I/O connector 358. Since the topmounting panel 318 is not necessarily part of a printed wiring assembly(PWA), the battery compartment 308 can connect electrical power to thelow profile PCBA 310 via a short wired battery connector 360.

In an exemplary aspect, the mounting bracket 304 can be substantially orentirely sheet metal, such as being stamped formed into a single sheetmetal stamping part. Such a device can be economically manufactured, canprovide durability and structural strength, and can provide thermal andelectrical conductivity. For example, the full height I/O panel 316 canserve as part of protective measures against electromagneticinterference. However, embodiments consistent with the presentdisclosure can be formed of other materials, at least in part.

With reference to FIGS. 5-6, for clarity, a convention used herein isfor the expansion card 165 to be inserted in a downward vertical planewith the top mounting panel 318 being above the low profile PCBA 310,which in turn is above the internal I/O connector 370 mounted on abottom surface 372 of an enclosure of an IHS 100. The full height I/Opanel 316 is also inserted along a vertical plane into an I/O panelframe 378 installed within an opening in the enclosure. The full heightI/O panel 316 is orthogonal to the top mounting panel 318 and lowprofile PCBA 310. While this convention is maintained throughout theseveral views, it should be appreciated that expansion card 165 may beoriented horizontally or at angles other than a perpendicular (or closeto perpendicular) angle.

Referring to FIG. 7, there is illustrated an example method 700 by whicha full height expansion card consistent with one or more aspects of thepresent disclosure can be manufactured and/or assembled. Method 700begins at start block. Method 700 includes manufacturing a mountingbracket having (i) a full height I/O panel sized for insertion into anI/O panel frame extended across an opening of an enclosure of aninformation handling system and (ii) a top mounting panel attached tothe full height I/O panel and extending orthogonally away from the fullheight I/O panel (block 710). The manufacturing is completed via one ormore manufacturing processes, as described herein. Method 700 thenprovides physically attaching a low profile PCBA to at least one of thetop mounting panel and the full height I/O panel, thereby defining afull height expansion card (block 720). Following, method 700 includesattaching a full height heat sink to the low profile PCBA (block 730).The full height heat sink efficiently dissipates heat generated by thelow profile PCBA away from one or more functional components of the lowprofile PCBA and enables a denser concentration of processing componentsand/or placement of more advanced (i.e., higher heat dissipating)processing components on the low profile PCBA.

In one or more embodiments, the method 700 further provides that thefull height heat sink is configured to and extends across a portion ofthe top mounting panel, leaving a space for the battery compartment andbattery on the top mounting panel. Method 700 also includes attaching,within the battery space, a battery compartment to the top mountingpanel (block 740). With the battery inserted and attached to the PCBA'sprocessing components, the battery communicates backup electrical powerto the processing component incorporated in the low profile PCBA (block750). The full height heat sink dissipates heat from the low profilePCBA (block 760). The method then ends at end block.

Alternatively, or in addition, method 700 may further provide forbackward compatibility for a low profile PCBA that conventionally wasattached to an upper and lower tab of a low profile I/O panel. Toachieve the backward compatibility, a low profile heat sink is mountedon the low profile PCBA using the same attachment holes that wereutilized for the full height heat sink. By providing a full heightexpansion card, the method can further provide for inserting theexpansion card into an internal I/O connector and I/O panel frame of anenclosure of an IHS. Also, in one embodiment, the method can includeembossing a top edge of the top mounting panel, such that a card holdercan frictionally engage the top edge in a manner similar to gripping athicker PCBA.

In the above described flow chart, one or more of the methods may beembodied in a computer readable device containing computer readable codesuch that a series of functional processes are performed when thecomputer readable code is executed on a computing device. In someimplementations, certain steps of the methods are combined, performedsimultaneously or in a different order, or perhaps omitted, withoutdeviating from the scope of the disclosure. Thus, while the methodblocks are described and illustrated in a particular sequence, use of aspecific sequence of functional processes represented by the blocks isnot meant to imply any limitations on the disclosure. Changes may bemade with regards to the sequence of processes without departing fromthe scope of the present disclosure. Use of a particular sequence istherefore, not to be taken in a limiting sense, and the scope of thepresent disclosure is defined only by the appended claims.

One or more of the embodiments of the disclosure described can beimplementable, at least in part, using a software-controlledprogrammable processing device, such as a microprocessor, digital signalprocessor or other processing device, data processing apparatus orsystem. Thus, it is appreciated that a computer program for configuringa programmable device, apparatus or system to implement the foregoingdescribed methods is envisaged as an aspect of the present disclosure.The computer program may be embodied as source code or undergocompilation for implementation on a processing device, apparatus, orsystem. Suitably, the computer program is stored on a carrier device inmachine or device readable form, for example in solid-state memory,magnetic memory such as disk or tape, optically or magneto-opticallyreadable memory such as compact disk or digital versatile disk, flashmemory, etc. The processing device, apparatus or system utilizes theprogram or a part thereof to configure the processing device, apparatus,or system for operation.

While the disclosure has been described with reference to exemplaryembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted forelements thereof without departing from the scope of the disclosure. Inaddition, many modifications may be made to adapt a particular system,device or component thereof to the teachings of the disclosure withoutdeparting from the essential scope thereof Therefore, it is intendedthat the disclosure not be limited to the particular embodimentsdisclosed for carrying out this disclosure, but that the disclosure willinclude all embodiments falling within the scope of the appended claims.Moreover, the use of the terms first, second, etc. do not denote anyorder or importance, but rather the terms first, second, etc. are usedto distinguish one element from another.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the disclosure.As used herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The description of the present disclosure has been presented forpurposes of illustration and description, but is not intended to beexhaustive or limited to the disclosure in the form disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope of the disclosure. Thedescribed embodiments were chosen and described in order to best explainthe principles of the disclosure and the practical application, and toenable others of ordinary skill in the art to understand the disclosurefor various embodiments with various modifications as are suited to theparticular use contemplated.

What is claimed is:
 1. An expansion card for an information handlingsystem, the expansion card comprising: a mounting bracket comprising afull height input/output (I/O) panel sized for insertion in an I/O panelframe of an enclosure and comprising a top mounting panel attached tothe full height I/O panel and extending orthogonally away from the fullheight I/O panel; and a low profile printed circuit board assembly(PCBA) physically attached to at least one of the top mounting panel andthe full height I/O panel, wherein the mounting bracket and the lowprofile PCBA define a full height expansion card; and a full height heatsink attached to the low profile PCBA and extending across a portion ofthe top mounting panel to provide increased heat dissipation forfunctional components of the low profile PCBA during operation of thelow profile PCBA.
 2. The expansion card of claim 1, further comprising amounting plate positioned on a back side of the low profile PCBA andfastened through at least two holes in the low profile PCBA to the fullheight heat sink.
 3. The expansion card of claim 1, wherein the lowprofile PCBA further comprises a processing component that generatesheat dissipated by the full height heat sink, wherein the expansion cardfurther comprises a battery space on the top mounting panel and abattery compartment attachable to the top mounting panel within thebattery space and in electrical communication with the processingcomponent.
 4. The expansion card of claim 1, wherein the low profilePCBA comprises a pair of mounting holes spaced for attachment to upperand lower tabs of a low profile I/O panel, and wherein the full heightI/O panel of the mounting bracket comprises a pair of tabs presentingrespective mounting holes identically positioned to the low profile I/Opanel.
 5. The expansion card of claim 4, wherein the at least two holesthrough the low profile PCBA are identically spaced to at least twoholes on a low profile heat sink to enable interchangeability.
 6. Theexpansion card of claim 5, wherein an unattached lengthwise edge of thetop mounting panel comprises an embossed surface to frictionally engagea card holder of a device in which the card is inserted.
 7. Theexpansion card of claim 1, wherein the full height I/O panel and the topmounting panel comprises a single sheet metal stamping part.
 8. Aninformation handling system, comprising: an enclosure having at leastone input/output (I/O) connector in communication with enclosedcomponents of the information handling system; an I/O panel frameattached across an opening in the enclosure; and an expansion cardcommunicatively coupled to an I/O connector at the I/O panel frame andcomprising: a mounting bracket comprising a full height I/O panel sizedfor insertion in the I/O panel frame and comprising a top mounting panelattached to the full height I/O panel and extending orthogonally awayfrom the full height I/O panel; a low profile printed circuit boardassembly (PCBA) physically attached to at least one of the top mountingpanel and the full height I/O panel, wherein the mounting bracket andlow profile PCBA define a full height expansion card, the low profilePCBA having a card edge insertably connectable to a selected one I/Oconnector to communicate with the enclosed components; and a full heightheat sink attached to the low profile PCBA and extending across aportion of the top mounting panel to provide increased heat dissipationfor functional components of the low profile PCBA during operation ofthe low profile PCBA.
 9. The information handling system of claim 8,wherein the expansion card further comprises a mounting plate positionedon a back side of the low profile PCBA and fastened through at least twoholes in the low profile PCBA to the full height heat sink.
 10. Theinformation handling system of claim 8, wherein the low profile PCBA ofthe expansion card further comprises a processing component thatgenerates heat dissipated by the full height heat sink, wherein theexpansion card further comprises a battery space on the top mountingpanel and a battery compartment attachable to the top mounting panelwithin the battery space and in electrical communication with theprocessing component.
 11. The information handling system of claim 8,wherein the low profile PCBA of the expansion card comprises at leasttwo mounting holes spaced for attachment to upper and lower tabs of alow profile I/O panel, and wherein the full height I/O panel of themounting bracket comprises a pair of tabs presenting respective mountingholes identically positioned to the low profile I/O panel.
 12. Theinformation handling system of claim 11, wherein the at least twomounting holes through the low profile PCBA of the expansion card areidentically spaced to at least two holes on a low profile heat sink toenable interchangeability.
 13. The information handling system of claim12, further comprising a card holder, wherein an unattached peripheraledge of the top mounting panel of the expansion card comprises anembossed surface to frictionally engage the card holder.
 14. Theinformation handling system of claim 8, wherein the full height I/Opanel and the top mounting panel of the expansion card comprises asingle sheet metal stamping part.
 15. A method for providing a fullheight expansion card, the method comprising: manufacturing a mountingbracket having (i) a full height input/output (I/O) panel sized forinsertion in an I/O panel frame extended across an opening of anenclosure of an information handling system and (ii) a top mountingpanel attached to the full height I/O panel and extending orthogonallyaway from the full height I/O panel; physically attaching a low profileprinted circuit board assembly (PCBA) to at least one of the topmounting panel and the full height I/O panel, wherein the mountingbracket and low profile PCBA define a full height expansion card; andattaching a full height heat sink to the low profile PCBA, the fullheight heat sink extending across the top mounting panel, wherein thefull height heat sink enables efficient dissipation of heat generated bythe low profile PCBA away from one or more functional components of thelow profile PCBA.
 16. The method of claim 15, further comprisingattaching a mounting plate positioned on a back side of the low profilePCBA by inserting fasteners that pass through respective holes in thelow profile PCBA to engage the full height heat sink.
 17. The method ofclaim 15, further comprising: attaching, within a battery space, abattery compartment to the mounting panel; and communicating electricalpower from a battery module retained in the battery compartment to aprocessing component incorporated in the low profile PCBA; wherein theprocessing component generates heat, and the heat that is generated bythe processing component is dissipated away from the low profiled PCBAvia the full height heat sink, which enables faster and more efficientheat dissipation.
 18. The method of claim 15, further comprisinginterchangeably assembling the low profile PCBA to the mounting bracketand a low profile I/O panel by: forming a pair of mounting holes in thelow profile PCBA spaced for attachment to upper and lower tabs of thelow profile I/O panel; and fastening a pair of tabs on the full heightI/O panel to the pair of mounting holes in the low profile PCBA, whereinspacing of the pair of tabs are identically positioned to those on thelow profile I/O panel.
 19. The method of claim 18, further comprisinginterchangeably assembling the low profile PCBA to the mounting bracketand a low profile I/O panel by forming at least two holes in the fullheat sink in identical spacing to corresponding at least two holes inthe low profile heat sink.
 20. The method of claim 15, furthercomprising frictionally engaging a card holder to an embossed surface ofan unattached peripheral edge of the top mounting panel.